Embedded packaging method capable of realizing heat dissipation
US11114310B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded packaging method capable of realizing heat dissipation, includes: providing a frame having at least one through hole; attaching a tape on the first surface and placing a device in the through hole; completely filling the through hole with photosensitive insulating material, and completely curing the photosensitive insulating material in a lower portion of the through hole while not completely curing the photosensitive insulating material in an upper portion of the through hole and covered on the second surface; electroplating on the first surface to form a first metal layer, and electroplating on the upper surface and a side surface of the device, an upper surface of the photosensitive insulating material and an upper end face of each of the first copper pillars to form a second metal layer; and etching to obtain a first circuit layer and a second circuit layer, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.