Weldon Beardain
4Patents
3h-index
5Co-inventors
36Inventor score
Filing activity: Oct 1, 1998 → Nov 8, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6720574B2 | Method of testing a semiconductor chip | Electricity | 11 | Expired |
| US6376352B1 | Stud-cone bump for probe tips used in known good die carriers | Electricity | 8 | Expired |
| US7898275B1 | Known good die using existing process infrastructure | Electricity | 3 | Expired |
| US7122895B2 | Stud-cone bump for probe tips used in known good die carriers | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.