Stud-cone bump for probe tips used in known good die carriers
US7122895B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2001 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Mar 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a membrane for use in conjunction with a semiconductor carrier and the membrane which includes an electrically insulating substrate and an interconnect pattern formed on the substrate. A stud is coupled to the interconnect pattern over the substrate by forming a gold ball, preferably by gold ball bonding techniques, and coating a portion of the gold ball with a compliant material, preferably an epoxy resin. The coating is filled with a material having sufficient hardness to be capable of penetrating the oxide film on the contact pads of semiconductor devices. The flakes are preferably silver or silver-based.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.