Stud-cone bump for probe tips used in known good die carriers
US6376352B1 · kind B1 · utility
8Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1999 |
| Grant date | Apr 23, 2002 |
| Priority date | — |
| Expiry date | Nov 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a membrane for use in conjunction with a semiconductor carrier and the membrane which includes an electrically insulating substrate and an interconnect pattern formed on the substrate. A stud is coupled to the interconnect pattern over the substrate by forming a gold ball, preferably by gold ball bonding techniques, and coating a portion of the gold ball with a compliant material, preferably an epoxy resin. The coating is filled with a material having sufficient hardness to be capable of penetrating the oxide film on the contact pads of semiconductor devices. The flakes are preferably silver or silver-based.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.