Wen Wu
6Patents
5h-index
9Co-inventors
52Inventor score
Filing activity: Jan 11, 1996 → Feb 3, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7727882B1 | Compositionally graded titanium nitride film for diffusion barrier applications | Electricity | 38 | Active |
| US7682966B1 | Multistep method of depositing metal seed layers | Electricity | 26 | Active |
| US5948169A | Apparatus for preventing particle deposition in a capacitance diaphragm gauge | Chemistry; Metallurgy | 18 | Expired |
| US8017523B1 | Deposition of doped copper seed layers having improved reliability | Electricity | 18 | Active |
| US8298936B1 | Multistep method of depositing metal seed layers | Electricity | 16 | Active |
| US5782942A | Filter system for semiconductor furnace | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.