Werner Ertle
2Patents
1h-index
9Co-inventors
27Inventor score
Filing activity: Jun 12, 2003 → Jul 29, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7190077B2 | Semiconductor structure integrated under a pad | Electricity | 3 | Expired |
| US8044394B2 | Semiconductor wafer with electrically connected contact and test areas | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.