Method for making fused high density multi-layer integrated circuit module
US5135556A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Aug 4, 1992 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fused high density multi-layered integrated circuit module for integrating infrared detector arrays to signal conditioning circuits is disclosed. The module comprises a plurality of thin film substrate layers disposed in substantially overlapping registry to form a non-conductive supporting body, a plurality of the layers have electronic devices mounted thereon. A plurality of detector element connectors are formed along a first edge portion of the body. Conductive conduits are formed upon a plurality of the layers. The conductive conduits have first portions which interconnect the detector element connectors to the electronic devices disposed upon the layers of the body. The conductive conduits also have second portions formed upon the surface of said layers and extending to the second edge portion thereof for communicating signals between the electronic devices and external electronics. A glass binding material adhesively attaches adjacent substrate layers together. The glass binding material has a coefficient of expansion of the substrate layers such that thermal stress is reduced and the need for a buffer board is consequently eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.