William Nevin
7Patents
6h-index
13Co-inventors
60Inventor score
Filing activity: Aug 5, 1977 → Feb 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6841848B2 | Composite semiconductor wafer and a method for forming the composite semiconductor wafer | Performing Operations; Transporting | 32 | Expired |
| US4240783A | Combined display container, cigarette lighter, candle holder | Human Necessities | 20 | Expired |
| US6955988B2 | Method of forming a cavity and SOI in a semiconductor substrate | Electricity | 15 | Expired |
| US4965225A | Method of stabilizing amorphous semiconductors | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7122416B2 | Method for forming a filled trench in a semiconductor layer of a semiconductor substrate, and a semiconductor substrate with a semiconductor layer having a filled trench therein | Electricity | 10 | Expired |
| US7153757B2 | Method for direct bonding two silicon wafers for minimising interfacial oxide and stresses at the bond interface, and an SOI structure | Electricity | 8 | Expired |
| US10297502B2 | Isolation structure for micro-transfer-printable devices | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.