William WONG
5Patents
2h-index
11Co-inventors
48Inventor score
Filing activity: Sep 22, 1997 → Mar 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6201403A | Integrated circuit package shielding characterization method and apparatus | Electricity | 18 | Expired |
| US7885388B2 | Method and apparatus for initiating communication via a multi-mode system in a vehicle | Electricity | 8 | Active |
| US9083320B2 | Apparatus and method for electrical stability compensation | Electricity | 1 | Active |
| US10396796B2 | Circuit, system and method for thin-film transistor logic gates | Electricity | 0 | Active |
| US12288520B2 | Method and system for CMOS-like logic gates using TFTs and applications therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.