Xavier Baraton
3Patents
1h-index
4Co-inventors
37Inventor score
Filing activity: Jun 14, 2004 → Jun 29, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9012269B2 | Reducing warpage for fan-out wafer level packaging | Electricity | 3 | Active |
| US9455241B2 | Integrated circuit package and method of forming the same | Electricity | 0 | Active |
| US7247928B2 | Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.