Xiaoyan Yi
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Mar 14, 2012 → Jan 3, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9246052B2 | Packaging structure of light emitting diode and method of manufacturing the same | Electricity | 0 | Active |
| US9791790B2 | Method of aligning quadrate wafer in first photolithography process | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.