Xuanjun LIU
2Patents
1h-index
1Co-inventors
27Inventor score
Filing activity: Sep 26, 2019 → Dec 30, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11107726B2 | Method for manufacturing bonding pad in semiconductor device | Electricity | 1 | Active |
| US12080606B2 | Semiconductor manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.