Ya-Hsiang Chen
4Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Jun 7, 2009 → Oct 29, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8377815B2 | Manufacturing method of a semiconductor load board | Electricity | 2 | Active |
| US7871892B2 | Method for fabricating buried capacitor structure | Electricity | 1 | Active |
| US8312624B1 | Method for manufacturing a heat dissipation structure of a printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US8754328B2 | Laminate circuit board with a multi-layer circuit structure | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.