Yan Liu
4Patents
2h-index
18Co-inventors
41Inventor score
Filing activity: Dec 4, 2003 → Jul 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7842543B2 | Wafer level chip scale package and method of laser marking the same | Electricity | 10 | Active |
| US7483735B2 | Apparatus and method for monitoring body composition by measuring body dielectric constant and body impedance based on the method of frequency digital sampling | Physics | 4 | Expired |
| US12025501B2 | Three-dimensional displacement compensation method for microscopic thermoreflectance thermography and control device | Physics | 0 | Active |
| US11439871B2 | System and method for rehabilitation | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.