Three-dimensional displacement compensation method for microscopic thermoreflectance thermography and control device
US12025501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2022 |
| Grant date | Jul 2, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/0077
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A three-dimensional displacement compensation method is provided. The method includes an obtaining step, a transforming step, a first determining step, a first calculating step and a compensating step. The obtaining step includes obtaining a current image of a measured element captured by a microscopic thermoreflectance thermography device. The transforming step includes two sub-steps. One sub-step uses Fourier transform to calculate a reference image to obtain a first result, and the other sub-step uses Fourier transform to calculate the current image to obtain a second result. The first determining step includes determining a peak point coordinate and a fitting diameter of a point spread function of an optical system of the device. The first calculating step includes calculating a three-dimensional displacement of the position to be compensated relative to the reference position. The compensating step compensates the position to be compensated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.