Yi Lin
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: May 5, 2020 → Dec 2, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11621181B2 | Dual-sided molding for encapsulating electronic devices | Electricity | 0 | Active |
| US11955347B2 | Encapsulation process for double-sided cooled packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.