Dual-sided molding for encapsulating electronic devices
US11621181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2020 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jan 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3121
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.