Inventor · Boise, ID, US

Ying Chen

4Patents
1h-index
4Co-inventors
33Inventor score

Filing activity: Jan 9, 2013 → Aug 6, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US9373955B2 Devices and methods related to electrostatic discharge-protected CMOS switches Electricity 3 Active
US10790251B2 Methods for enhancing adhesion of three-dimensional structures to substrates Electricity 0 Active
US9692120B2 Devices and methods related to electrostatic discharge-protected CMOS switches Electricity 0 Active
US11276658B2 Devices with three-dimensional structures and support elements to increase adhesion to substrates Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.