Devices with three-dimensional structures and support elements to increase adhesion to substrates
US11276658B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Aug 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13083
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.