Methods for enhancing adhesion of three-dimensional structures to substrates
US10790251B2 · kind B2 · utility
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2References
19Claims
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Key dates
| Filing date | Jun 20, 2018 |
| Grant date | Sep 29, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13083
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming supports for 3D structures on semiconductor structures comprise forming the supports from photodefinable materials by deposition, selective exposure and curing. Semiconductor dice including 3D structures having associated supports, and semiconductor devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.