Ying-Lien Chen
3Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Mar 22, 2017 → Oct 25, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10153231B2 | Interconnect structure and fabrication method thereof | Electricity | 1 | Active |
| US10079177B1 | Method for forming copper material over substrate | Electricity | 0 | Active |
| US10446489B2 | Interconnect structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.