Ying-Xu Lu
3Patents
2h-index
10Co-inventors
34Inventor score
Filing activity: Jun 9, 2017 → Mar 9, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10217649B2 | Semiconductor device package having an underfill barrier | Electricity | 6 | Active |
| US10586716B2 | Semiconductor device package | Electricity | 3 | Active |
| US11164756B2 | Semiconductor device package having continously formed tapered protrusions | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.