Yoonsoo LEE
3Patents
1h-index
6Co-inventors
33Inventor score
Filing activity: Sep 25, 2017 → Dec 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10607919B2 | Semiconductor package having junction cooling pipes embedded in substrates | Electricity | 1 | Active |
| US11201105B2 | Semiconductor package having a spacer with a junction cooling pipe | Electricity | 0 | Active |
| US11967540B2 | Integrated circuit direct cooling systems having substrates in contact with a cooling medium | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.