Semiconductor package having junction cooling pipes embedded in substrates
US10607919B2 · kind B2 · utility
1Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Sep 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1094
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.