Youngik Kwon
5Patents
1h-index
3Co-inventors
33Inventor score
Filing activity: Nov 12, 2019 → May 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11764161B2 | Ground connection for semiconductor device assembly | Electricity | 1 | Active |
| US11515174B2 | Semiconductor devices with package-level compartmental shielding and associated systems and methods | Electricity | 0 | Active |
| US11362071B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
| US11621245B2 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Electricity | 0 | Active |
| US11942455B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.