Semiconductor devices with package-level compartmental shielding and associated systems and methods
US11515174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2019 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Feb 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mold chase for packaging a compartmentally shielded multifunctional semiconductor is provided. The mold chase generally includes a first cavity and a second cavity separated by a trench plate positioned between a first component and a second component of the multifunctional semiconductor between which a compartmental shield is required. The mold chase is lowered into a molding position over the multifunctional semiconductor and a molding material is injected through an inlet sprue into the first and second cavities to surround the first and second components, respectively. After the molding material is cured, the mold chase is removed and an open trench is formed in the cured molding material by the trench plate. The open trench is filled with a conductive material to form the compartmental shield. A conformal shield may be added to cover the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.