Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems
US11621245B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2020 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jun 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This patent application relates to microelectronic device packages with internal EMI shielding, methods of fabricating and related electronic systems. One or more microelectronic devices of a package including multiple microelectronic devices are EMI shielded, and one or more other microelectronic devices of the package are located outside the EMI shielding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.