Youngkwan Lee
4Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Nov 12, 2019 → May 28, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11031328B2 | Semiconductor package | Electricity | 3 | Active |
| US11469148B2 | Semiconductor package having a redistribution layer for package-on-package structure | Electricity | 1 | Active |
| US11239148B2 | Semiconductor package | Electricity | 0 | Active |
| US11626362B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.