Youngkyu Lim
4Patents
0h-index
6Co-inventors
24Inventor score
Filing activity: Dec 4, 2019 → Sep 1, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12176308B2 | Package substrate and semiconductor package including the same | Electricity | 0 | Active |
| US11756908B2 | Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the same | Electricity | 0 | Active |
| US11302661B2 | Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same | Electricity | 0 | Active |
| US11264339B2 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.