Yu-Chih Yu
3Patents
1h-index
2Co-inventors
27Inventor score
Filing activity: Oct 4, 2012 → Mar 10, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8810045B2 | Packaging substrate and semiconductor package | Electricity | 1 | Active |
| US9006039B2 | Fabrication method of packaging substrate, and fabrication method of semiconductor package | Electricity | 0 | Active |
| US9165789B2 | Fabrication method of packaging substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.