Yuichi Kakizono
4Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Jan 31, 2006 → Apr 11, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8092277B2 | Method of grinding semiconductor wafers, grinding surface plate, and grinding device | Performing Operations; Transporting | 2 | Active |
| US7288207B2 | Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same | Chemistry; Metallurgy | 1 | Expired |
| US9550264B2 | Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer | Electricity | 0 | Active |
| US9017145B2 | Polishing solution distribution apparatus and polishing apparatus having the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.