Polishing solution distribution apparatus and polishing apparatus having the same
US9017145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2011 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Jan 7, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.