Yun-Hsiang Tien
6Patents
3h-index
11Co-inventors
50Inventor score
Filing activity: Jan 3, 2003 → Oct 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7125745B2 | Multi-chip package substrate for flip-chip and wire bonding | Electricity | 15 | Expired |
| US7091583B2 | Method and structure for prevention leakage of substrate strip | Electricity | 8 | Expired |
| US6921981B2 | Ball grid array package | Electricity | 6 | Expired |
| US11670836B2 | Semiconductor device package | Electricity | 0 | Active |
| US8089164B2 | Substrate having optional circuits and structure of flip chip bonding | Electricity | 0 | Active |
| US9219048B2 | Substrate having pillar group and semiconductor package having pillar group | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.