Semiconductor device package
US11670836B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2020 |
| Grant date | Jun 6, 2023 |
| Priority date | — |
| Expiry date | Feb 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1421
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.