Yuntae Lee
2Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: Nov 12, 2019 → Mar 18, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11469148B2 | Semiconductor package having a redistribution layer for package-on-package structure | Electricity | 1 | Active |
| US11205631B2 | Semiconductor package including multiple semiconductor chips | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.