Patent · US Active

Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface

US10000375B2 · kind B2 · utility

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0References

6Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Frank Reichenbach · Wannweil, DE
Jochen Reinmuth · Reutlingen, DE
Jens Frey · Echterdingen, DE
Julia Amthor · Reutlingen, DE

Key dates

Filing date	Oct 21, 2016
Grant date	Jun 19, 2018
Priority date	—
Expiry date	Oct 21, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0145
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating a material area of the substrate or the cap converted into a liquid aggregate state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.