Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
US10002857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2016 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Aug 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.