Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US10006136B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jul 27, 2016 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Jul 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/205
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.