Semiconductor device and manufacturing method thereof
US10008393B2 · kind B2 · utility
7Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Feb 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.