Inventor · Bucheon-si, KR

Won Chul Do

66Patents
10h-index
66Co-inventors
81Inventor score

Filing activity: Apr 27, 2001 → May 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9000586B2 Semiconductor device and manufacturing method thereof Electricity 40 Active
US8362612B1 Semiconductor device and manufacturing method thereof Electricity 40 Active
US9941180B2 Semiconductor device and manufacturing method thereof Electricity 22 Active
US9048125B2 Semiconductor device and manufacturing method thereof Electricity 20 Active
US8552548B1 Conductive pad on protruding through electrode semiconductor device Electricity 19 Active
US7042068B2 Leadframe and semiconductor package made using the leadframe Electricity 17 Expired
US8487445B1 Semiconductor device having through electrodes protruding from dielectric layer Electricity 13 Active
US7138707B1 Semiconductor package including leads and conductive posts for providing increased functionality Electricity 11 Expired
US8796072B2 Method and system for a semiconductor device package with a die-to-die first bond Electricity 10 Active
US9349681B1 Semiconductor device package and manufacturing method thereof Electricity 10 Active
US9391043B2 Semiconductor device and manufacturing method thereof Electricity 8 Active
US10008393B2 Semiconductor device and manufacturing method thereof Electricity 7 Active
US10283400B1 Semiconductor device package and manufacturing method thereof Electricity 6 Active
US8410585B2 Leadframe and semiconductor package made using the leadframe Electricity 6 Active
US9966300B1 Semiconductor device package and manufacturing method thereof Electricity 6 Active
US10340244B2 Semiconductor device and manufacturing method thereof Electricity 5 Active
US10475770B2 Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof Electricity 5 Active
US9553041B1 Semiconductor device package and manufacturing method thereof Electricity 4 Active
US10388582B2 Semiconductor device and manufacturing method thereof Electricity 4 Active
US9966276B2 Semiconductor device and manufacturing method thereof Electricity 4 Active
US9136159B2 Method and system for a semiconductor for device package with a die-to-packaging substrate first bond Electricity 4 Active
US9536858B2 Semiconductor device and manufacturing method thereof Electricity 3 Active
US8981572B1 Conductive pad on protruding through electrode semiconductor device Electricity 3 Active
US8618658B1 Semiconductor device and fabricating method thereof Electricity 3 Active
US9040349B2 Method and system for a semiconductor device package with a die to interposer wafer first bond Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.