Separation method, computer storage medium, and separation system
US10008419B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 22, 2012 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Aug 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1911
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.