PCB hybrid redistribution layer
US10009992B2 · kind B2 · utility
6Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2016 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Dec 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid PCB system has a hybrid redistribution layer that redistributes a large pad-to-pad pitch to a smaller, finer pad-to-pad pitch and applies hybrid materials to balance the thermal-mechanical stress. The hybrid PCB system combines wafer level packaging, IC substrate and high density PCB technologies within a single hybrid PCB. The hybrid PCB system addresses the opportunity for interconnect reliability, design and assembly of a electronic components with pad pitches less than 400 microns directly to a PCB without need of an IC substrate or interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.