Joan K. Vrtis
15Patents
5h-index
14Co-inventors
59Inventor score
Filing activity: Jun 29, 2000 → Jan 18, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6407929B1 | Electronic package having embedded capacitors and method of fabrication therefor | Emerging Cross-Sectional Technologies | 110 | Expired |
| US6751099B2 | Coated heat spreaders | Emerging Cross-Sectional Technologies | 17 | Expired |
| US9521748B1 | Mechanical measures to limit stress and strain in deformable electronics | Electricity | 7 | Active |
| US10009992B2 | PCB hybrid redistribution layer | Electricity | 6 | Active |
| US7219421B2 | Method of a coating heat spreader | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9661743B1 | Flexible circuit board and method of fabricating | Emerging Cross-Sectional Technologies | 4 | Active |
| US9723713B1 | Flexible printed circuit board hinge | Electricity | 3 | Active |
| US10123603B1 | Diffuse fiber optic lighting for luggage | Physics | 3 | Active |
| US10154583B1 | Mechanical strain reduction on flexible and rigid-flexible circuits | Electricity | 3 | Active |
| US9521754B1 | Embedded components in a substrate | Electricity | 2 | Active |
| US10499500B2 | Circuit board with embedded metal pallet and a method of fabricating the circuit board | Electricity | 2 | Active |
| US9549463B1 | Rigid to flexible PC transition | Electricity | 1 | Active |
| US10015880B1 | Rip stop on flex and rigid flex circuits | Electricity | 1 | Active |
| US9736947B1 | Nano-copper via fill for enhanced thermal conductivity of plated through-hole via | Electricity | 0 | Active |
| US12402659B2 | Heater assembly comprising a printed circuit board | Human Necessities | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.