Rip stop on flex and rigid flex circuits
US10015880B1 · kind B1 · utility
1Cited by
55References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Dec 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rip stop material is attached at a stress area of a flexible circuit board in order to strengthen the flexible circuit board and minimize ripping and cracking in the polyimide and/or the copper conductors of the circuit. A rip stop transition layer is formed and deposited at a location on the flexible circuit in order to minimize, reduce, if not preventing cracking and ripping of the circuit as it is bent and flexed. The rip stop transition layer can be placed at different locations on and within the flexible circuit in order to minimize cracking and ripping as the flexible circuit is bent, flexed and twisted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.