Plasma processing apparatus, plasma processing method and storage medium for storing program for executing the method
US10020172B2 · kind B2 · utility
0Cited by
2References
3Claims
0Family size
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Key dates
| Filing date | May 26, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Aug 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a plasma processing apparatus including a susceptor, having a substrate mounting portion for mounting thereon a substrate; a focus ring including an outer ring and an inner ring; a dielectric ring; a dielectric constant varying device for varying a dielectric constant of the dielectric ring; a grounding body positioned at an outside of the dielectric ring with a gap from a bottom surface of the focus ring; and a controller for controlling a top surface electric potential of the focus ring by controlling a current flowing from the susceptor to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.