Apparatus and methods for backside passivation
US10020187B2 · kind B2 · utility
0Cited by
9References
10Claims
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Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Dec 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided apparatus and methods for back side passivation of a substrate. The systems comprise an elongate support with an open top surface forming a support ring so that when a substrate is on the support ring, a cavity is formed within the elongate support. A plasma generator is coupled to the cavity to generate a plasma within the cavity to deposit a passivation film on the back side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.