Substrate support assembly with deposited surface features
US10020218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2015 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Aug 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes and depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.