Polymer via plugs with high thermal integrity
US10020244B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2012 |
| Grant date | Jul 10, 2018 |
| Priority date | — |
| Expiry date | Jun 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.