Substrate treatment system
US10025190B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 15, 2014 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Dec 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment system for treating a substrate, includes: a treatment station in which a plurality of treatment apparatuses which treat the substrate are provided; an interface station which directly or indirectly delivers the substrate between an exposure apparatus which is provided outside the substrate treatment system and performs exposure of patterns on a resist film on the substrate, and the substrate treatment system; a light irradiation apparatus which performs post-exposure using UV light on the resist film on the substrate after the exposure of patterns is performed; and a post-exposure station which houses the light irradiation apparatus and is adjustable to a reduced pressure or inert gas atmosphere, wherein the post-exposure station is connected to the exposure apparatus directly or indirectly via a space which is adjustable to a reduced pressure or inert gas atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.