On-product derivation and adjustment of exposure parameters in a directed self-assembly process
US10025285B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2015 |
| Grant date | Jul 17, 2018 |
| Priority date | — |
| Expiry date | Apr 12, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/33285
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and metrology tool modules embodying the methods are provided. Methods comprise measuring characteristics of intermediate features such as guiding lines in a directed self-assembly (DSA) process, deriving exposure parameters from the measured characteristics; and adjusting production parameters for producing consecutive target features according to the derived exposure parameters. The methods and modules enhance the accuracy of the DSA-produced structures and related measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.