Patent · US Active

On-product derivation and adjustment of exposure parameters in a directed self-assembly process

US10025285B2 · kind B2 · utility

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16Claims
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Key dates

Filing dateJun 30, 2015
Grant dateJul 17, 2018
Priority date
Expiry dateApr 12, 2036

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/33285
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods and metrology tool modules embodying the methods are provided. Methods comprise measuring characteristics of intermediate features such as guiding lines in a directed self-assembly (DSA) process, deriving exposure parameters from the measured characteristics; and adjusting production parameters for producing consecutive target features according to the derived exposure parameters. The methods and modules enhance the accuracy of the DSA-produced structures and related measurements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.